AE-760EBT: Intel® Core™ i9 + NVIDIA® RTX MXM Industrial Edge AI PC

The motherboard BIOS applies optimized power profiles tailored specifically for industrial deployments: Long-term Power Limit (PL1) is locked at 125W, while the Short-term Power Limit (PL2) allows bursts up to 219W for a duration of 28 seconds.

To sustain this without thermal dropping, the system utilizes 4x composite copper heat pipes mated directly to the CPU core, drawing heat to an aluminum fin array cooled by twin 80mm high-static-pressure PWM fans. In a 55°C ambient environment running continuous validation workloads, the CPU core temperature stabilizes below 92°C, allowing the P-cores to maintain a steady 3.0GHz to 3.5GHz baseline clock indefinitely.

They are completely independent. We do not use low-cost single-channel switch chips to bridge network traffic. Instead, the mainboard integrates 4x independent Intel® i226-IT industrial-grade 2.5GbE controllers, each occupying a dedicated PCIe lane.

When aggregating four high-bandwidth GigE Vision cameras running simultaneously at full 2.5Gbps line speed, the total system throughput approaches 10Gbps. This native architecture prevents internal bus congestion, packet collision, and dropped frames at the edge.

The standard out-of-the-box Board Support Package (BSP) pre-integrates the device tree overlay for the onboard MAX9296 deserializer chipset.

• Native Support: For industry-standard vehicle and industrial vision sensors (e.g., IMX390, AR0231), we provide compiled .dtb files and kernel patches file directly.
• Third-Party Integration: If you are deploying proprietary sensor modules, BITECH supplies the complete BSP source repository. Alternatively, our hardware engineering lab can develop customized sensor drivers for your deployment.

Both edge deployment platforms feature an isolated wide-range DC 9V to 36V power stage equipped with reverse-polarity protection, over-current cutoff, and transient voltage suppression (TVS) diodes.

To handle typical 12V or 24V lead-acid/lithium battery voltage drops caused by high-torque motor startup (where bus voltage dips down to 9V for up to 100ms), the onboard DC-to-DC converters and high-capacitance solid-state capacitor banks sustain smooth internal voltage output, preventing sudden system resets or power-off failures.

Due to the physical volume constraints of a compact, active-cooled industrial chassis, the mainboard hard-caps the power allocation for the MXM 3.1 Type-B slot at a maximum Total Graphics Power (TGP) of 115W.

When selecting an RTX 4060 MXM (115W), it runs unthrottled at maximum factory clock rates. If configuring for flagship RTX 5080 or RTX 5090 MXM modules, the GPU must be throttled to the 115W power tier via custom VBIOS or driver constraints. This preserves full Tensor Core INT8 inference logic metrics while keeping system thermal profiles stable.

Yes, they feature 4000V magnetic and signal isolation arrays to isolate ground loops and high-voltage spikes caused by heavy industrial equipment or switching contactors.

For impedance balancing across extended field-bus line drops, the mainboard features onboard 120Ω termination resistors accessible via physical jumper pins. This complies with standard common-mode rules (60Ω loop law) and eliminates reflection-induced data loss without requiring external line terminators.

Selection depends entirely on your software framework and enclosure type:

• Specify AE-NJ60BT (ARM): Best for completely sealed, dust-prone enclosures. It operates entirely on passive chassis conduction across a wide -40°C to +70°C thermal layer, provided your pipeline is compiled natively for JetPack/TensorRT.
• Specify AE-760EBT (x86): Required if running traditional Windows 11 workloads, complex C++ logic frameworks, or raw PyTorch pipelines. Because it utilizes dual 80mm exhaust fans, the deployment cabinet must feature filtered air intake paths or louvers to maintain airflow over the outer fin blocks.

It is a discrete, hardware-level security chip utilizing the Infineon SLB9670 platform, bypassing the security vulnerabilities associated with CPU-simulated firmware TPM (fTPM).

For high-security industrial grid or critical national infrastructure applications, BITECH supports factory-level UEFI Secure Boot customization. We can securely flash your proprietary encryption signatures (PK, KEK, db keys) directly into the custom BIOS firmware matrix during production, locking the operating state against physical firmware injection attacks.

The dual 80mm active cooling array employs industrial dual-ball-bearing fan modules with a verified MTBF greater than 70,000 operational hours. They feature native tachometer monitoring th5-7at feeds direct fan-fault alerts straight to system logs or external GPIO pins.

The thermal design is modular: The fan brackets are external to the sealed internal chassis. You can remove four outer plate screws to swap out a fan module in under two minutes without disturbing the primary copper heat pipes, thermal pads, or factory sealing layers.

BITECH implements a strict BOM (Bill of Materials) Freeze Policy once an OEM/ODM configuration is approved for series integration. All onboard IC components, network controllers, and chassis specifications are selected exclusively from the Intel Embedded Roadmap and industrial component channels ensuring a 10 year lifecycle guarantee.

In the event of an unavoidable sub-tier component termination, we enforce a mandatory 6 to 12-month Product Change Notice (PCN) or End-of-Life (EOL) alert track, allowing our B2B volume accounts ample validation window to secure last-time-buy allocations or verify dropped-in replacement modules.

Yes — an edge AI box PC can run a local LLM fully on-device, and the right platform depends on model size. An x86 box with a discrete RTX MXM GPU (16–32 GB VRAM) runs 7B–34B models at interactive speed and 70B quantized; a Jetson Orin module runs 7–8B models fanless; and an RK3588 board handles small 1–4B assistants. All keep data on-premise with no cloud calls.