Shenzhen manufacturer · Vehicles · Outdoor ·  Factory floors

Edge AI Computers & Industrial PCs for Environments That Break Standard Hardware

BITECH manufactures edge AI computers, fanless box PCs, and rugged panel PCs for deployments where standard hardware fails — on vehicles and mobile robots, in outdoor and roadside enclosures, on energy infrastructure, and on factory floors. Isolated I/O, wide-range DC power, fanless wide-temperature construction, and a 10-year lifecycle commitment, engineered and built in Shenzhen.
Most of our work starts with a deployment, not a part number. When no catalogue product fits, we engineer the board to your envelope — custom dimensions, I/O and BIOS — in 1–3 months, from 100 units

10 days
STANDARD SAMPLE
100 units
OEM MINIMUM
10 yr
PLATFORM LIFECYCLE
BITECH Edge AI industrial computers family
Trusted by OEMs across 30+ countries
CEFCCRoHSUKCAMIL-STD-810G
100% units pass a industrial mainboard  18-hour full-load burn-in, Assembled industrial computer 18-hour burn-in
< 0.3%
Field RMA rate
10 yr
Lifecycle support
30+
Countries shipped
100%
Aging / burn-in tested

Engineering Pillars

Industrial PC engineering: resilience & deterministic architecture

Three measurable criteria drive every design decision in our fanless industrial computers. Full technical depth lives in the linked whitepapers.


Modular SOM Architecture (AX Series)

Intel 4th–14th gen · one carrier board

Swap the compute module, keep the carrier board — a core feature of our AX series. Upgrade CPUs without mechanical redesign or re-certification, ensuring a guaranteed 7+ year supply footprint

SOM lifecycle management whitepaper


4000V Galvanic Isolation Firewall

COM · CAN · DIO – AE series & ODM variants

An electrical firewall stops ground loops and surges at the interface — before they cascade into the core.

Galvanic isolation whitepaper


Native CAN bus, all speeds

4000 V isolation · 60 Ω integrity

Hardware-level CAN controller with deterministic timing — no USB bridges, no jitter, no reflection errors.

CAN bus isolation whitepaper

Modular Architecture

AX-230BT /234BT/660EBT platform

CORE MODULE












CARRIER BOARD





4th–14th Gen Intel
4000 V Isolation

Engineering Access

What you’d normally be told no about

The requests that get declined elsewhere are the ones this company was built around. Four we hear most often — and what actually happens when you ask.

  • Mechanical Usually: no
    Change the board dimensions to fit an enclosure we already tooled.

    Custom-dimension mainboard, designed to your envelope.

    1–3 months from requirements review to first articles.

  • Interfaces Usually: no
    Add two isolated CAN ports and drop the serial ports we don’t use.

    Carrier I/O respecified at PCB level.

    Native controllers on the board — not adapted with dongles or USB bridges.

  • Volume Usually: no
    We need 200 units, not 5,000.

    Turnkey OEM from 100 units.

    NRE quoted upfront, before you commit to anything.

  • Supply Usually: no
    Keep this exact BOM available for eight years.

    BOM lock under formal PCN.

    Last-time-buy notice issued before any component change.

Tell us what you’ve been refused

An engineer, not a sales desk, replies within 48  hours.

Product Platforms

Hardware Platforms: Embedded Box PCs, Edge AI & Industrial Touch Panels

Three families, one engineering standard.

AX-130BT Modular Industrial Computer
AX SERIES

Modular embedded PCs

Intel 4th–14th genSOM + carrier7+ yr lifecycle−40 °C to +60 °C
AE-3588BT RK3588 Edge AI industrial pcs
AE-3588 SERIES

Edge AI computing

Up to 58 TOPS (6 onboard + 52 expansion)8K media pipelineFanless−40 °C to +80 °C
AP-AW1SIP65 industrial HMI
AP / PANEL SERIES

Rugged Industrial Panel PCs & HMI

IP65 front panelMulti-touchVESA / panel mount
Quality Assurance

100% Two-Stage Burn-In Testing — 18h + 18h

Failures belong in our factory, not in your field deployment.

Every BITECH industrial computer undergoes a two-stage burn-in process before shipment: 18 hours at motherboard level plus full interface verification, then 18 hours after final assembly. This process is applied to 100% of production units, not statistical samples, with test records linked to each unit’s serial number.

18-Hour Industrial Motherboard Burn-In Test

Board-Level Validation Before Assembly

Before the motherboard enters final assembly, it runs continuously under load for 18 hours. The test verifies CPU stability under sustained load, DDR memory stability, SSD / storage operation, power delivery and voltage stability, thermal behavior of CPU, VRM and memory, LAN, USB, COM, CAN and other onboard interfaces, plus watchdog, RTC and BIOS functions.

18 HOURS100% BOARDSBEFORE ASSEMBLY

18-Hour Complete Industrial PC Burn-In Test

Final-System Validation After Assembly

After the motherboard is installed in the fanless enclosure, the complete industrial PC undergoes another 18-hour burn-in test. This second-stage test verifies sustained CPU and memory load, SSD read/write operation, complete-system temperature monitoring, power stability, final I/O verification, fanless thermal performance inside the enclosure, and automatic power-on and watchdog functions where configured. Only units that complete the full validation process are released for shipment.

18 HOURS100% SYSTEMSFINAL ASSEMBLY
18h + 18h
Two-stage burn-in
100%
Every production unit
SN Traceable
Test records linked to serial number
24 Months
Standard warranty
OEM / ODM

Tailored to Your Architecture: BITECH OEM/ODM Services

When standard industrial PCs limit your application, BITECH delivers exact-fit hardware engineering — from minor branding to full-scale, ground-up development.


Deep ODM Engineering

Full-Scale Customization

Off-the-shelf form factors and I/O layouts should never dictate your software’s potential. If our standard catalog doesn’t fit your blueprint, we build what does.


Bespoke Motherboard Design

We engineer custom-dimension mainboards from scratch, embedding the exact I/O density (such as isolated CAN, RS232/485, or specific PCIe/M.2 expansions) your project demands.


Thermal Management & Mechanical Architecture

Our team designs custom rugged enclosures and runs thermal simulations to optimize heat dissipation, ensuring stable performance for high-power processors in space-constrained or harsh environments.


 Kernel-Level BIOS & Firmware Customization

We develop tailored BIOS/Firmware to support specific boot sequences, optimized watchdog timers, hardware-level security, and specialized OS kernel integration (including custom Ubuntu/Debian BSPs).


Turnkey OEM Configuration

Rapid Branding & Configuration

Accelerate your time-to-market with deployment-ready hardware that carries your brand’s authority.


Private Labeling & Chassis Branding

Professional silk-screening, laser-engraved logos, custom chassis colors, and branded packaging designed to align seamlessly with your corporate identity.


Agile Hardware & I/O Configuration

Tailored I/O panel modifications, pre-installed memory/storage matrixes, and optimized default BIOS settings, allowing the hardware to be drop-shipped directly to your end-users.

STEP 01

Requirements review

Engineer-led feasibility review with a solution proposal within 48 hours.

STEP 02

Sample & validation

Standard platforms sampled in 10 days; custom carrier boards in 4 weeks.

STEP 03

Pilot run

Small-batch production with full test reports and serial-number traceability.

STEP 04

Mass production

Volume manufacturing with a 10-year supply commitment and ECO risk management.

MOQ from 100 units for Turnkey OEMNRE quoted upfrontI/O · enclosure · BIOS · branding
Start your project
For Engineers

Industrial PC Technical Resources for System Architects

Self-service resources for system architects and integration teams. Documentation written by engineers — completeness over brevity.


3D STEP models & DXF

Validate fit, clearance, and thermal budgets before procurement — sub-millimeter precision.

Submit Technical Request

Linux BSPs & SDKs

Ubuntu, Debian, and RT-Linux support packages with GPIO, CAN, and watchdog APIs.

Linux BSP downloads Submit Technical Request

Whitepapers & diagnostics

Thermal architecture, EMC compliance, isolation topology, CAN 60 Ω rule diagnostics.

Engineering center
Case Studies

Industrial computing case studies

Deployed, measured, still running.

Vehicle-mounted computing case study s-AX-234BT
Transportation & Mobile · Vehicle-mounted computing

Ruggedizing vehicle-mounted fleet computing in Denmark

AX-234BT industrial motherboards deployed as the central control unit in milk transport and waste management trucks — surviving dirty power, EMI, and continuous vibration with 9–36V input, 4000V isolated CAN bus, and burn-in QC.

9–36V
Wide-voltage input
4000V
Isolated CAN bus
18h
Burn-in per unit
Read case study
10.1inch IP65 PANEL sealed connectors ODM industrial panel pc for Brazil customer
Industrial ODM · Outdoor public infrastructure

Custom 10.1″ IP65 panel PC for municipal gardens

AP-AW1S outdoor alarm and monitoring terminal, engineered with IP65 sealing, aviation locking connectors, and fanless construction for 50+ municipal garden deployments.

50+
Municipal gardens deployed
IP65
Front panel sealing
10 yr
Supply commitment
View ODM solution

Engineering FAQs

Questions engineers ask before they specify

Lead times, isolation ratings, lifecycle, BSPs and deployment limits — answered without the marketing layer.

What is the typical sample lead time?

It depends on the level of customization:

  • Standard platforms (AE and AP series) — samples ship within 10 days.
  • Custom carrier board — approximately 4 weeks to sample and validate.
  • Fully custom mainboard designed to your mechanical envelope — 1–3 months from requirements review to first articles.
Is there an MOQ for OEM or private-label programs?

Yes. Turnkey OEM and private-label programs start at a minimum order quantity of 100 units. Non-recurring engineering costs are quoted upfront, before you commit — so budgeting for bespoke I/O, enclosure and BIOS requirements is transparent from the start.

Do you provide schematic review and integration support?

Yes. Our application engineers provide integration support including 3D STEP models for mechanical fit, Linux BSPs and SDKs, and schematic reviews for customized carrier board designs — so the hardware integrates cleanly into your architecture rather than being handed over at the box.

How do you support a 10-year lifecycle for industrial PCs?

Through strict bill of materials control and a modular System-on-Module architecture. Decoupling the compute module from the carrier board lets us manage component obsolescence proactively: when a component reaches end of life, we provide a pin-compatible upgrade path, so you avoid a full mechanical redesign or re-certification.

Changes are handled under formal PCN with last-time-buy notice issued before anything moves.

What operating systems and BSPs do you support?

Kernel-level support and custom Board Support Packages for Ubuntu, Debian and RT-Linux, alongside Windows 10 / 11 IoT Enterprise compatibility on x86 platforms. Our BSPs include documented APIs for native CAN, GPIO and watchdog timer integration.

One constraint worth knowing early: Arm platforms such as RK3588 run Linux or Android only — if your application requires Windows, the x86 platforms are the path.

How do your fanless computers manage heat in extreme environments?

Through passive cooling engineered per platform. Custom extruded aluminium chassis act as the heatsink, combined with controlled thermal pad placement and thermal simulation during mechanical design.

Systems operate reliably from −40 °C to +60 °C, with selected platforms rated to +80 °C. Because there are no fans, there are no vents to admit dust and no bearings to fail.

What quality assurance tests are performed before shipment?

Every unit — not a statistical sample — passes an 18-hour full-load burn-in before leaving our Shenzhen facility, with serial-number traceability and component lot tracking.

Products are compliant with CE, FCC, RoHS and UKCA, and are tested to MIL-STD-810G methods for shock and vibration for mobile and heavy-industrial deployments.

How do your systems handle ground loops and interface integrity?

Isolated platforms provide galvanic isolation rated to 4000 V withstand on COM, DIO and CAN interfaces — an electrical firewall that stops ground loops and field surges at the interface, before they cascade into the core.

For motion and fieldbus systems we use native hardware CAN / CAN FD controllers with deterministic timing, rather than software-emulated USB bridges, so bus timing stays predictable under load.

Isolation is specified per deployment rather than fixed on every model: a motor-drive network or vehicle bus gets it; a clean cabinet install on a unified ground doesn't need to pay for it.

Can your computers be deployed on vehicles or outdoors?

Yes — both are core deployments for us, not exceptions.

Vehicles and mobile equipment: wide-range 9–36 V DC input with ignition control, low-voltage cutoff to prevent battery drain when parked, and transient protection tested to ISO 7637-2 and ISO 16750-2, together with 4000 V isolated CAN and RS-485 for the vehicle bus.

Outdoor and roadside: sealed enclosures rated IP65 and above, fanless wide-temperature construction, and aviation (circular locking) connectors where standard ports would compromise the seal.

Do I actually need an industrial PC for this?

Not always. If the deployment is a clean, climate-controlled cabinet on conditioned power, with no fieldbus and easy physical access, a commercial machine is often the correct engineering call — and we will tell you so.

The premium on industrial hardware buys thermal design without a fan, a power input that tolerates a factory, isolated fieldbus, and a BOM that doesn't change silently. Whether that's worth paying for depends on your environment and your cost of downtime.

We wrote up where the line is, including the four cases where a mini pc win →

Question not answered here? Ask our engineering team →

Start a project

Tell us the deployment, not the part number

Send us the environment, what each line connects to, and what has already failed with your current hardware. An engineer — not a sales desk — replies within 2 business days with a preliminary assessment.

  • Standard model pricing, custom board design, or a full OEM programme
  • NRE quoted upfront, before you commit to anything
  • NDA signed before you share detailed specifications
Start an engineering inquiry Do you even need one

Prefer email? sales@bitechipc.com · WhatsApp +86 135 3816 4607

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