Industrial Edge AI Computers for Machine Vision, Robotics & Local AI

Match the silicon to your compute class and power budget. RK3588 (6–58 TOPS, 8–25W fanless) suits lightweight vision and cost-sensitive edge nodes. Jetson Orin (40–275 TOPS, 15–60W) fits multi-camera vision and AMR with the CUDA/TensorRT ecosystem. RTX MXM (80+ TFLOPS, 120–450W, active cooling) is for heavy inference, LLMs, and training-class workloads. Power envelope and operating temperature usually decide the boundary between them.

For AMR perception, the AE-NJ60BT (Jetson Orin NX, up to 157 TOPS) is the strongest fit — it offers MIPI CSI / GMSL2 camera ingress, 4x GbE, dual CAN FD, and -40C to +70C fanless operation. For lighter-cost AGV nodes, the AE-3588LBT (32 TOPS RK3588) provides low-latency fieldbus I/O at a lower price point. See our AMR controller solution →

For high-throughput multi-camera vision, the AE-NJ60BT (Jetson Orin) handles parallel camera streams with GMSL2/MIPI ingress and the DeepStream pipeline. For maximum inference performance — high-resolution AOI or model ensembles — the AE-760EBT (Intel i9 + RTX MXM) delivers GPU-class throughput. The AE-3588BT covers cost-sensitive single- or few-camera inspection.

All three are RK3588-based. The AE-3588BT scales to 58 TOPS and adds 4000V isolated CAN/serial/GPIO for harsh environments like energy and semiconductor. The AE-3588LBT scales to 32 TOPS with non-isolated low-latency I/O for AOI and AGV. The AE-3588NBT is a cost-effective 6 TOPS gateway with 8K HDMI out and 4K HDMI in for vision automation and infrastructure.

Choose a discrete RTX MXM GPU (the AE-760EBT) when you need the full CUDA/PyTorch/TensorRT stack, run large models or LLMs at the edge, or require training-class throughput. NPU platforms (RK3588, Jetson) are more power-efficient and fanless, but a discrete GPU delivers far higher raw compute when your workload demands it — at the cost of higher power and active cooling.

Yes. Beyond the standard models, BITECH offers custom baseboard design, enclosure sizing, and branded chassis modification (the AE-NY series) down to PCB level. This lets you match a specific compute module, camera interface, I/O layout, and form factor to your product, with batch deployment from low MOQ. See our OEM/ODM customization →

Yes, depending on the model. The AE-3588BT provides 4000V galvanic isolation on CAN, RS232/RS485, and GPIO for high-noise environments, and the AE-760EBT includes isolated DIO/COM. Isolation level and interface count can be specified at the project level. How interface isolation works →

Send your model type, target framerate, camera count and interface, power/thermal limits, and environment through our RFQ form. You talk directly to our hardware engineers, who will recommend the right silicon and configuration and arrange evaluation samples — typically within a 1–3 month cycle.